PlatingOps Thickness & Yield
Forward
Rectifier Current input
Total Amps (Zn + Ni) read directly from rectifier displays
Zn amps
Ni amps
Part & Line
Surface per Part
Total platable surface area of one part, in square inches. Found on the job traveler or engineering drawing. For simple shapes: length × width × number of exposed faces.
Parts per Rack
Number of parts hanging on a single rack. Count the active hooks on one loaded rack.
Line Speed
Conveyor drive frequency. Higher Hz = faster line = less dwell time = thinner deposit. Read from the VFD or conveyor control panel.
Rack Loading
Every-Other Racks
Total active rack positions when loading every other hook on the conveyor.
Every-Third Racks
Total active positions when loading every third hook. Fewer racks = more amps per rack = thicker deposit.
Custom Rack Count
Any other rack count — partial loads, specialty parts, dialing in a thickness target.
Custom Rack Rate (racks/min)
Rack rate per minute for the Custom scenario, used for throughput calculations. Reference: Every-Other ≈ 4–11 racks/min, Every-Third ≈ 2–7.5 racks/min, depending on Hz.
Thickness Specification
Min Spec
Minimum acceptable thickness from the customer spec or job traveler. Common Zn-Ni: 8 µm.
Max Spec
Maximum acceptable thickness. Above this wastes metal and risks dimensional issues.
Reverse Mode
Enter a target thickness to calculate the amps required to hit it.
Target Thickness (µm)
Advanced Settings
Cathode Efficiency (%)
Percentage of applied current that actually deposits metal. Typical chloride Zn-Ni: 85–95%. Default 90%.
Zn:Ni Ratio
How total amps split between Zn and Ni rectifiers. Default 1:1.2 favors Zn for a chloride bath under normal titration. Adjust when daily titrations show metals out of balance.
Financials
Price per Part ($)
Revenue per finished part. Used for hourly yield in each scenario.
Throughput Display
Results
Every Other
Every Third
Custom
Deposit Thickness
ASF
A/ft²
Total Area
ft²
Mils
thousandths
Side-by-side comparison
Scenario µm mils ASF Status